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The development of epoxy printed circuit board (PCB) has ushered in a new peak

the development of epoxy printed circuit board (PCB) has ushered in a new peak, and the industry reshuffle is inevitable. The expert said that the world's electronic circuit industry, whether PCB, CCL or other related industries, has begun to recover comprehensively since the second half of 2003. The development of the whole electronic circuit industry, especially in Chinese Mainland, has ushered in a new peak. Driven by domestic demand and the continuous transfer of foreign industries, China has gradually formed a central region with the largest output value of PCB and CCL and the most active technological development. China's PCB has ushered in new development opportunities, but competition at a new level will optimize and adjust the industry structure and realize industrial upgrading

according to the statistical data of the world electronic circuit Council WECC. In the epoxy resin printed circuit board (PCB) industry, Japan's output value in 2006 was about US $11.7 billion, an increase of 4%; The output value of South Korea was US $5.7 billion, an increase of 5.7%; The output value of China is 12.8 billion US dollars (calculated by 1:7. The main body of tensile testing machine and dynamometer 80), and the global output value is expected to be about 45 billion to 46 billion US dollars. This good growth momentum will continue until 2007. From the perspective of the world PCB product structure, the requirements of the next generation of electronic systems for PCBs are highlighted in higher density. With the development of multi-function, miniaturization and lightweight of electronic machine products, multilayer board, flexible printed circuit board FPC, rigid flex bonding board, hdi/bum substrate, IC packaging substrate and other varieties have become products in great demand. In recent years, the technological development of PCB in the world has focused on passive (i.e. embedded or embedded) component PCB, optical technology PCB and other new PCB products, inkjet PCB technology, and the application of nano materials on PCB

at present, the development characteristics of the world PCB industry are as follows: first, with the chip integration of components and the increasingly popular packaging forms of integrated circuits BGA (ball grid array), CSP (chip level packaging) and MCM (multi chip module), PCB shows the development trend of micro refinement of packaging terminals and high integration of packaging, so as to meet the requirements of high-density assembly; Second, with the development of optical interface technology, it will appear on PCB to realize optical wiring technology, optical printed circuit board technology, optical surface installation technology and modular technology of photoelectric integration (design technology and installation technology of the same module combination of optical devices and electrical components); Third, with the high-speed of the system, the impedance matching of PCB has become an important problem. According to the signal speed and wiring length, the material testing machine is the product of the combination of modern electronic technology and mechanical transmission technology, and the distortion is required to be reduced to less than 10% or 5% or even 3%; Fourth, in order to adapt to the development of CSP and flip chip packaging (FC), high-density PCB with internal through hole (IVH) structure needs to be used, but its high price limits its use. Therefore, it is necessary to continuously optimize the existing stacking process to realize low-cost mass production of PCB with IVH structure

in addition, it has other characteristics, mainly: in order to meet the needs of CSP and FC packaging development with fine terminal spacing, the conductor pattern micro refinement technology will develop in the direction of minimum line width/spacing of 25 m/25 m, wiring center distance of 50 m, and conductor thickness of less than 5 m; The laser through-hole technology is the mainstream of the multilayer board through-hole processing means of the stacking method. The CO2 laser and UV laser processing machine will become the mainstream of the development suitable for practical technology. Its minimum through-hole diameter will be reduced from the current 50 m ~ 80 m to 30 m, and the aperture accuracy and through-hole position accuracy will be improved to 15 m; PCB boards with thin passive components embedded inside have been applied in GSM mobile, and PCB boards with IC components embedded inside and flexible circuit boards with thin film components will appear in the future; The maturity and development of inkjet printing technology will make it possible to produce PCB at a lower cost and faster speed; A new generation of PCB made of nano materials has appeared in the world. The wide use of nanotechnology will have a positive impact on reducing the dielectric constant of PCB, improving mechanical properties, improving the heat resistance of products and the application of industrial environmental protection

investment extends to both ends of PCB, which is an important trend of this industrial chain. Jinyiding invested 100million yuan to establish an electronic waste and PCB recycling plant in Tianjin; Hua Weihua built CCL Jinan assaying different material change experimental machine in Changshu, and its change experiments are different sheet metal plants; Hitachi chemical has invested 15million US dollars to establish a dry film production plant in Dongguan, which will have a total capacity of 10000 m2/year with the old plant after completion; Gubaode electronics covers an area of 105 mu in Suzhou and establishes a PCB Factory. The first phase has 2-6 floors and a production capacity of 36000 m2/month. The second phase is PCB for LCD with a production capacity of 30000 m2/month; Mingxing electronics invested US $255million in Wuhan, and after the completion of the Guangzhou plant, the PCB production capacity of China's polyurethane adhesive research and development started in the 1960s, with an annual output of 9million m2; Xinyang group and Suzhou Panasonic Electric Co., Ltd. jointly invested 1billion yen to set up a flexible copper foil plant in Kunshan. Songyang electronic materials will produce 60000 m2 and 150000 m2 of protective films for copper foil substrates for glue free flexible plates every month; Changchun Group invested 20million yuan to build Changchun chemical in Zhangzhou, Fujian Province, as a ccppbt (positive ion coordinated poly (butylene terephthalate) line resin project; The second factory in Shanghai invested by otes with hundreds of millions of dollars was put into operation in August 2006; Jianding plans to build Wuxi No.4 factory

in addition, Nanxing group will build a PCB plant in Zhuhai in three phases, with 20million yuan in the first phase, producing 2-8 layers of PCB; Baocheng group expanded its production base in East China, adding new HDI and IC carrier plates; Ricoh Group invested US $16.8 million in Shenzhen to build a 50000 m2 Ricoh Industrial Park; Xinxing electronics built two new factories in Suzhou and Kunshan in 2006, with a capacity of 28000 m2 of HDI and multilayer boards; Jingpeng Suzhou plant expanded its production from 15000 m2 per month to 25000 m2; Jiantao invested US $120million in Jiangyin, covering an area of 320 mu, to build the Yangtze Petrochemical Industrial Park in Lingang New City, including an annual output of 10000 tons of tetrabromobisphenol A, 25000 tons of resin and 11million tons of CCL. After completion, the annual sales volume will reach 2billion yuan; South Asia invested 613million US dollars to expand the PCB raw material production capacity in Kunshan. The company expanded the production capacity of glass yarn and glass cloth by 40000 tons and 9million M2 respectively; Jingcheng circuit technology has invested 20million yuan in three phases in Qimen, Anhui Province. The first phase of production is 30000 m2 for one side and 30000 m2 for two sides, and the annual output value can reach 15million yuan. Wei Chuang is preparing to set up a large PCB Factory in China to support its computers, game consoles and other products; Weixun is preparing to build an aircraft carrier for flexible panel production; Huiya is adjusting and expanding its production. Foxconn is investing US $1billion in Yantai phase I, covering an area of 1.2 square kilometers, and building a comprehensive industrial park for PCB R & D, production and supporting facilities. From 2005 to 2008, more and more overseas enterprises invested in PCB, CCL, materials and equipment in China, with larger amounts, longer and longer industrial chains, extending to both ends of PCB, among which HDI, FPC, IC carrier and CCL have the largest growth momentum. Chinese enterprises, including joint-stock and state-owned enterprises, especially many small and medium-sized private enterprises, are also expanding production capacity and improving product grades, but the investment intensity, scale and grade are far from being comparable with overseas enterprises

facing this situation, anxiety far outweighs joy. Although according to the principle of localization, all enterprises in Chinese Mainland are Chinese enterprises, the local proportion is less than 1/3. This indicates that in China, the electronic circuit industry will continue to develop at a high speed in recent years; It also indicates that the competition between PCB and CCL will become more intense and even cruel; This also indicates that China will experience a reshuffle in the electronic circuit industry. A number of small and medium-sized enterprises that are hard, lack characteristics, low quality, sell only at low prices, and lack strategic vision will face the choice of survival or destruction. China's electronic circuits need to be bigger and stronger. This can only be achieved through two rounds of diversification and nationalization, and the strength of the key national enterprises is the foundation

environmental protection is the top priority. At present, China has become the world's largest manufacturer of epoxy printed circuit boards (PCBs). In Chinese Mainland, the output of circuit boards reached 13 trillion square meters in 2006. According to the average weight of 30 tons per 10000 square meters, the total weight reached 390000 tons. The material utilization rate of copper clad laminate substrate processed into circuit board is about 90%, that is, the annual consumption of substrate by printed circuit board manufacturing enterprises is about 144.4 million square meters, and the generated corner waste is about 14.4 million square meters. According to the average weight of 25 tons per 10000 square meters, there are 36000 tons of corner waste; In addition, the edge waste of base material production enterprises is about 7% of their finished products, and it can be calculated that the edge waste generated by CCL is 25000 tons; The utilization rate of the finished printed circuit board in the whole machine factory is about 95%, and it can be calculated that the waste of the whole machine factory is 20000 tons. The sum of the above three items is 81000 tons

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