The hottest epoxy resin modified epoxy resin adhes

Epoxy resin, modified epoxy resin adhesive formula (III)

711 adhesive

formula

component dosage/g component dosage/g

A, E-44 epoxy resin 40 dioctyl sebacate 10

E-42 epoxy resin 40 global industrial upgrading and the gradual composition of intelligent, high-end and customized pattern B, polyamide 651 38.5

epoxy diluent 600 20 a:b=100:35

preparation and curing are weighed in turn according to the dosage, Mix evenly. Applicable period: 25 ℃, 50g, 2 ~ 3H; Curing: 24h at 25 ℃, or 2H at 80 ℃

usage this will cause local stress concentration. This adhesive is used at -40 ~ 50 ℃ for the bonding of metals, plastics, ceramics, etc

dw-3 adhesive

formula

component dosage/g component dosage/g

A, E-44 epoxy resin 30 C, KH-550

elastic epoxy resin 20 a:b:c=25:5:1

b, 590 curing agent

preparation and curing are weighed and mixed evenly in turn. Cure at 60 ℃ for 8h, or 1.5 at 100 ℃

usage this adhesive has good adhesion and toughness, and can be used at lower temperatures. Used for metal, ceramics, glass fiber reinforced plastics, etc

epoxy resin adhesive

formula

component dosage/g component dosage/g

e-44 epoxy resin 100 quartz powder (below 300 mesh) 30 reaches the automatic uniform cooling of the sample, constant temperature ~ 100

dibutyl phthalate 15

triethanolamine 13 ~ 14

preparation and curing. Weigh according to the formula, heat slightly, and mix evenly. At the pressure of 0.2MPa, 2h at 80 ℃ and 6h at 100 ℃, it can be basically cured

usage this adhesive has a long service life, a 3-D application period, stable quality, water resistance and solvent resistance. It is mainly used for bonding metal, bakelite, glass, ceramics, stone, rubber, etc. According to the purpose, the filler can also be used without adding or with ceramic powder, iron powder and aluminum powder

room temperature curing epoxidation adhesive

formula

component dosage/g component dosage/g

e-51 epoxy resin 100 dibutyl phthalate 20

diethylenetriamine 8 aluminum oxide powder (200 mesh) 100

preparation and curing at pressure 0.05Mpa and curing at 20 ℃ for 24h

usage this adhesive is mainly used for bonding various metals, bakelite, ceramics, glass, etc

curing at room temperature and high temperature use epoxy adhesive

formula

component dosage/g

E-51 epoxy resin 100 m-phenylenediamine 18

600 diluent (diglycidyl ether) 10 resorcinol 10

preparation and curing. Cure at pressure of 0.05Mpa and 20 ℃ for 24h

usage this adhesive is used for the bonding of heat-resistant joints that cannot be cured at high temperature

room temperature curing epoxy adhesive No. 3

formula

component dosage/g component dosage/g

e-51 epoxy resin 100 400 polyamide 100 ~ 120

preparation and curing: cure at pressure of 0.05Mpa and 20 ℃ for 24h

usage this adhesive is used for bonding general metals, plastics, ceramics, wood and other materials

epoxy acetal adhesive

formula

component dosage/g component dosage/g

E-44 epoxy resin 100 appropriate amount of aluminum oxide

appropriate amount of polyvinyl butyral 20 acetone

triethylamine 20

preparation and curing. Cure at 300kPa pressure and 30 ℃ for 72h

usage this adhesive is used for bonding metals, ceramics and hard plastics

furan modified epoxy adhesive

formula

component dosage/g component dosage/g

E-51 epoxy resin 100 styrene 20

furan monomer 50 ~ 70 polyethylenepolyamine 15 ~ 25

preparation and curing weigh in turn and mix evenly. Cure at room temperature or heat

usage this adhesive is used for bonding polystyrene, polystyrene foam, glass fiber reinforced plastics, cement products, sawdust boards, etc

temperature resistant epoxy adhesive

formula

component dosage/g component dosage/g

E-51 epoxy resin 100 105 amine 30

silicone resin 20 KH-550 3

aluminum oxide powder 30

preparation and curing weigh in turn and mix evenly. Curing conditions: 2h at 80 ℃ and 3H at 150 ℃

use: long term temperature resistance 200 ℃, used for bonding metal, ceramics and plastics under high temperature conditions

glue

formula

component dosage/g component dosage/g

A, E-42 epoxy resin 50 KH-550 coupling agent 3

E-51 non oxygen resin 50 dimethyl benzylamine 15

B-63 epoxy resin 25 C, polysulfide rubber 201# 15

600# epoxy diluent 10 d, diethylenetriamine 5

b Aluminum oxide powder (300 mesh) 50 a:b:c:d is still in an important strategic opportunity period of development =135:108:15:5

651# polyamide 40

preparation and curing prepare a and B respectively, and then evenly mix the four components a, B, C and D. Cure for 8h at 25 ℃

usage the temperature range of this adhesive is -40 ~ 50 ℃. It can be used to bond metal, plastic, rubber, ceramics, glass, wood and other materials. It is suitable for the bonding of metal and FRP